Qualcomm Technologies, Inc. vs Intel Corporation
Select two employer filers to compare H-1B LCA filing volume, DOL certification rates, listed offered wages, and top job titles from Department of Labor disclosure records. LCA filings are not USCIS petition approvals, visa issuances, or proof of employment. See our methodology.
Key Metrics
| Metric | Qualcomm Technologies, Inc. | Intel Corporation |
|---|---|---|
| Total LCA Filings | 8,523 | 12,438 ▲ |
| Certified LCA Filings | 8,426 | 12,426 |
| DOL Certification Rate (higher is better) | 98.9% | 99.9% ✓ |
| Avg Salary (higher is better) | $137,650 ✓ | $124,489 |
| Salary Range | $61,672 – $293,784 | $57,637 – $294,299 |
| Total Workers | 174,463 | 20,252 |
| Active Years | FY2023–FY2026 | FY2023–FY2026 |
✓ Higher indicates the more favorable value. Data: DOL LCA FY2023–FY2026.
Top H-1B Job Titles
Qualcomm Technologies, Inc.
| Job Title | LCA Filings | Avg Wage |
|---|---|---|
| Senior ASICS Engineer | 317 | $116,325 |
| Senior Software Engineer | 285 | $120,549 |
| ASICS Engineer | 274 | $110,495 |
| Staff ASICS Engineer | 231 | $142,174 |
| Software Engineer | 223 | $110,683 |
| Senior Cellular System Test Engineer | 198 | $1,396,640 |
Intel Corporation
| Job Title | LCA Filings | Avg Wage |
|---|---|---|
| Component Design Engineer | 2,793 | $123,287 |
| Process Engineer | 2,772 | $110,857 |
| Software Engineer | 2,465 | $228,377 |
| Packaging Engineer | 435 | $112,107 |
| Graphics Hardware Engineer | 426 | $803,939 |
| Engineering Manager | 342 | $178,269 |
Year-over-Year LCA Filing Volume
| Fiscal Year | Qualcomm Technologies,, LCA Filings | Intel Corporation, LCA Filings |
|---|---|---|
| FY2023 | 3,744 (3659 cert.) | 4,494 (4491 cert.) |
| FY2024 | 1,862 (1856 cert.) | 3,732 (3725 cert.) |
| FY2025 | 1,934 (1932 cert.) | 2,800 (2799 cert.) |
| FY2026 | 983 (979 cert.) | 1,412 (1411 cert.) |
Download the national H-1B LCA summary cited on this page: h1b-statistics.csv (derived from DOL OFLC disclosure files; CC BY 4.0 with attribution).