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University of Illinois Springfield vs JPMorgan Chase & Co

Select two employers to compare H-1B petition volume, certification rates, salary data, and top job titles using DOL LCA data, drawn from the program's 85,000 annual visa cap. See our methodology.

Employer A

University of Illinois Springfield

Springfield, IL

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Employer B

JPMorgan Chase & Co

Chicago, IL

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Key Metrics

Metric University of Illinois JPMorgan Chase &
Total Petitions 6 11,961
Certified Petitions 6 11,917
Approval Rate (higher is better) 100.0% 99.6%
Avg Salary (higher is better) $82,383 $155,291
Median Salary , ,
Salary Range $65,000 – $115,000 $60,000 – $500,000
Total Workers 6 12,778
Active Years FY2023–FY2023 FY2023–FY2026

✓ Higher indicates the more favorable value. Data: DOL LCA FY2023–FY2026.

Top H-1B Job Titles

University of Illinois Springfield

Job Title Petitions Avg Wage
Research Specialist 2 $65,000
Assistant Professor 2 $103,500
Senior Data Analyst 1 $79,300
Lead Application Developer 1 $78,000

JPMorgan Chase & Co

Job Title Petitions Avg Wage
Vice President, Lead Software Engineer 1,519 $332,546
Associate, Software Engineer III 1,159 $139,278
Associate, Software Engineer 853 $134,889
Vice President, Software Engineer 776 $162,853
Vice President, Sr Lead Software Engineer 378 $179,321
Vice President, Software Engineering 237 $155,080

Year-over-Year Petition Volume

Fiscal Year University of, Petitions JPMorgan Chase, Petitions
FY2023 6 (6 cert.) 4,359 (4070 cert.)
FY2024 - 3,541 (2903 cert.)
FY2025 - 3,534 (3517 cert.)
FY2026 - 527 (526 cert.)