PlainVisa

Radia, Inc vs Dish Wireless LLC

Select two employers to compare H-1B petition volume, certification rates, salary data, and top job titles using DOL LCA data, drawn from the program's 85,000 annual visa cap. See our methodology.

Employer A

Radia, Inc

Boulder, CO

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Employer B

Dish Wireless LLC

Englewood, CO

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Key Metrics

Metric Radia, Inc Dish Wireless LLC
Total Petitions 7 722
Certified Petitions 7 703
Approval Rate (higher is better) 100.0% 97.4%
Avg Salary (higher is better) $150,153 $109,378
Median Salary , ,
Salary Range $110,000 – $185,000 $68,016 – $890,328
Total Workers 7 786
Active Years FY2023–FY2025 FY2023–FY2026

✓ Higher indicates the more favorable value. Data: DOL LCA FY2023–FY2026.

Top H-1B Job Titles

Radia, Inc

Job Title Petitions Avg Wage
Stability and Control, Flight Control Laws Lead Engineer 1 $185,000
Senior Manufacturing Engineer 1 $111,072
Mechanical Engineer 1 $110,000
Loads and Aeroelastics Lead Engineer 1 $185,000
Landing System Specialist, Mechanical Systems 1 $165,000
Electrical Systems Engineer 1 $160,000

Dish Wireless LLC

Job Title Petitions Avg Wage
Senior RF Engineer 36 $105,440
RF Engineer II 35 $99,270
Staff Engineer - Software 20 $129,638
Engineer II - Software 12 $97,531
Data Scientist II 11 $96,971
Data Engineer II 11 $90,828

Year-over-Year Petition Volume

Fiscal Year Radia, Inc, Petitions Dish Wireless, Petitions
FY2023 1 (1 cert.) 259 (254 cert.)
FY2024 4 (4 cert.) 176 (170 cert.)
FY2025 2 (2 cert.) 255 (245 cert.)
FY2026 - 32 (32 cert.)