Qualcomm Technologies, Inc vs Intel Corporation
Select two employers to compare H-1B petition volume, certification rates, salary data, and top job titles using DOL LCA data, drawn from the program's 85,000 annual visa cap. See our methodology.
Key Metrics
| Metric | Qualcomm Technologies, Inc | Intel Corporation |
|---|---|---|
| Total Petitions | 7,852 | 11,265 ▲ |
| Certified Petitions | 7,731 | 11,254 |
| Approval Rate (higher is better) | 98.5% | 99.9% ✓ |
| Avg Salary (higher is better) | $136,201 ✓ | $122,903 |
| Median Salary | , | , |
| Salary Range | $61,672 – $293,073 | $57,637 – $294,299 |
| Total Workers | 114,884 | 18,050 |
| Active Years | FY2023–FY2026 | FY2023–FY2026 |
✓ Higher indicates the more favorable value. Data: DOL LCA FY2023–FY2026.
Top H-1B Job Titles
Qualcomm Technologies, Inc
| Job Title | Petitions | Avg Wage |
|---|---|---|
| Senior ASICS Engineer | 279 | $116,028 |
| Senior Software Engineer | 255 | $119,552 |
| ASICS Engineer | 240 | $110,721 |
| Staff ASICS Engineer | 215 | $141,240 |
| Software Engineer | 202 | $110,733 |
| Senior Cellular System Test Engineer | 179 | $1,532,411 |
Intel Corporation
| Job Title | Petitions | Avg Wage |
|---|---|---|
| Component Design Engineer | 2,463 | $121,847 |
| Process Engineer | 2,240 | $109,903 |
| Software Engineer | 2,206 | $238,935 |
| Packaging Engineer | 391 | $110,097 |
| Graphics Hardware Engineer | 386 | $872,320 |
| Engineering Manager | 308 | $175,879 |
Year-over-Year Petition Volume
| Fiscal Year | Qualcomm Technologies,, Petitions | Intel Corporation, Petitions |
|---|---|---|
| FY2023 | 3,744 (3634 cert.) | 4,494 (4491 cert.) |
| FY2024 | 1,862 (1855 cert.) | 3,732 (3725 cert.) |
| FY2025 | 1,934 (1932 cert.) | 2,800 (2799 cert.) |
| FY2026 | 312 (310 cert.) | 239 (239 cert.) |