PlainVisa

tekAssembly Corporation vs JPMorgan Chase & Co

Select two employers to compare H-1B petition volume, certification rates, salary data, and top job titles using DOL LCA data, drawn from the program's 85,000 annual visa cap. See our methodology.

Employer A

tekAssembly Corporation

Vernon Hills, IL

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Employer B

JPMorgan Chase & Co

Chicago, IL

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Key Metrics

Metric tekAssembly Corporation JPMorgan Chase &
Total Petitions 105 11,961
Certified Petitions 102 11,917
Approval Rate (higher is better) 97.1% 99.6%
Avg Salary (higher is better) $98,675 $155,291
Median Salary , ,
Salary Range $75,000 – $147,400 $60,000 – $500,000
Total Workers 105 12,778
Active Years FY2023–FY2026 FY2023–FY2026

✓ Higher indicates the more favorable value. Data: DOL LCA FY2023–FY2026.

Top H-1B Job Titles

tekAssembly Corporation

Job Title Petitions Avg Wage
Software Developer 61 $98,600
Sr. Validation Test Lead 3 $95,000
Software Engineer 3 $103,040
Salesforce Admin 3 $102,800
SOFTWARE ENGINEER 3 $100,800
ETL Admin 3 $89,450

JPMorgan Chase & Co

Job Title Petitions Avg Wage
Vice President, Lead Software Engineer 1,519 $332,546
Associate, Software Engineer III 1,159 $139,278
Associate, Software Engineer 853 $134,889
Vice President, Software Engineer 776 $162,853
Vice President, Sr Lead Software Engineer 378 $179,321
Vice President, Software Engineering 237 $155,080

Year-over-Year Petition Volume

Fiscal Year tekAssembly Corporation, Petitions JPMorgan Chase, Petitions
FY2023 59 (59 cert.) 4,359 (4070 cert.)
FY2024 31 (28 cert.) 3,541 (2903 cert.)
FY2025 14 (14 cert.) 3,534 (3517 cert.)
FY2026 1 (1 cert.) 527 (526 cert.)