PlainVisa

Solomon Cordwell Buenz vs JPMorgan Chase & Co

Select two employers to compare H-1B petition volume, certification rates, salary data, and top job titles using DOL LCA data, drawn from the program's 85,000 annual visa cap. See our methodology.

Employer A

Solomon Cordwell Buenz

CHICAGO, IL

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Employer B

JPMorgan Chase & Co

Chicago, IL

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Key Metrics

Metric Solomon Cordwell Buenz JPMorgan Chase &
Total Petitions 37 11,961
Certified Petitions 37 11,917
Approval Rate (higher is better) 100.0% 99.6%
Avg Salary (higher is better) $70,097 $155,291
Median Salary , ,
Salary Range $57,949 – $95,000 $60,000 – $500,000
Total Workers 129 12,778
Active Years FY2023–FY2025 FY2023–FY2026

✓ Higher indicates the more favorable value. Data: DOL LCA FY2023–FY2026.

Top H-1B Job Titles

Solomon Cordwell Buenz

Job Title Petitions Avg Wage
DESIGNER TECHNICAL II 16 $64,315
ARCHITECT I 6 $71,943
DESIGNER TECHNICAL III 5 $74,206
DESIGNER TECHNICAL I 4 $66,298
Designer Technical III 2 $95,000
DESIGNER TECHNICAL IV 2 $81,817

JPMorgan Chase & Co

Job Title Petitions Avg Wage
Vice President, Lead Software Engineer 1,519 $332,546
Associate, Software Engineer III 1,159 $139,278
Associate, Software Engineer 853 $134,889
Vice President, Software Engineer 776 $162,853
Vice President, Sr Lead Software Engineer 378 $179,321
Vice President, Software Engineering 237 $155,080

Year-over-Year Petition Volume

Fiscal Year Solomon Cordwell, Petitions JPMorgan Chase, Petitions
FY2023 15 (15 cert.) 4,359 (4070 cert.)
FY2024 12 (12 cert.) 3,541 (2903 cert.)
FY2025 10 (10 cert.) 3,534 (3517 cert.)
FY2026 - 527 (526 cert.)