PlainVisa

Softcon USA, Inc vs JPMorgan Chase & Co

Select two employers to compare H-1B petition volume, certification rates, salary data, and top job titles using DOL LCA data, drawn from the program's 85,000 annual visa cap. See our methodology.

Employer A

Softcon USA, Inc

Park Ridge, IL

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Employer B

JPMorgan Chase & Co

Chicago, IL

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Key Metrics

Metric Softcon USA, Inc JPMorgan Chase &
Total Petitions 19 11,961
Certified Petitions 19 11,917
Approval Rate (higher is better) 100.0% 99.6%
Avg Salary (higher is better) $106,077 $155,291
Median Salary , ,
Salary Range $80,000 – $155,700 $60,000 – $500,000
Total Workers 19 12,778
Active Years FY2023–FY2025 FY2023–FY2026

✓ Higher indicates the more favorable value. Data: DOL LCA FY2023–FY2026.

Top H-1B Job Titles

Softcon USA, Inc

Job Title Petitions Avg Wage
Software Engineer 10 $102,710
DevOps Engineer 3 $139,467
Software Test Engineer 2 $81,150
Software Engineer 1 $106,600
SOFTWARE ENGINEER 1 $108,077
Database Administrator 1 $80,000

JPMorgan Chase & Co

Job Title Petitions Avg Wage
Vice President, Lead Software Engineer 1,519 $332,546
Associate, Software Engineer III 1,159 $139,278
Associate, Software Engineer 853 $134,889
Vice President, Software Engineer 776 $162,853
Vice President, Sr Lead Software Engineer 378 $179,321
Vice President, Software Engineering 237 $155,080

Year-over-Year Petition Volume

Fiscal Year Softcon USA,, Petitions JPMorgan Chase, Petitions
FY2023 6 (6 cert.) 4,359 (4070 cert.)
FY2024 10 (9 cert.) 3,541 (2903 cert.)
FY2025 3 (3 cert.) 3,534 (3517 cert.)
FY2026 - 527 (526 cert.)