Smart Techlink Solutions, Inc vs JPMorgan Chase & Co
Select two employers to compare H-1B petition volume, certification rates, salary data, and top job titles using DOL LCA data, drawn from the program's 85,000 annual visa cap. See our methodology.
Key Metrics
| Metric | Smart Techlink Solutions, | JPMorgan Chase & |
|---|---|---|
| Total Petitions | 18 | 11,961 ▲ |
| Certified Petitions | 18 | 11,917 |
| Approval Rate (higher is better) | 100.0% ✓ | 99.6% |
| Avg Salary (higher is better) | $88,853 | $155,291 ✓ |
| Median Salary | , | , |
| Salary Range | $79,706 – $106,558 | $60,000 – $500,000 |
| Total Workers | 18 | 12,778 |
| Active Years | FY2024–FY2026 | FY2023–FY2026 |
✓ Higher indicates the more favorable value. Data: DOL LCA FY2023–FY2026.
Top H-1B Job Titles
Smart Techlink Solutions, Inc
| Job Title | Petitions | Avg Wage |
|---|---|---|
| Computer Programmer | 4 | $79,706 |
| Software Engineer | 3 | $90,000 |
| UI Developer | 1 | $106,558 |
| Technical Lead | 1 | $106,558 |
| Technical Architect | 1 | $98,259 |
| Software Programmer | 1 | $79,706 |
JPMorgan Chase & Co
| Job Title | Petitions | Avg Wage |
|---|---|---|
| Vice President, Lead Software Engineer | 1,519 | $332,546 |
| Associate, Software Engineer III | 1,159 | $139,278 |
| Associate, Software Engineer | 853 | $134,889 |
| Vice President, Software Engineer | 776 | $162,853 |
| Vice President, Sr Lead Software Engineer | 378 | $179,321 |
| Vice President, Software Engineering | 237 | $155,080 |
Year-over-Year Petition Volume
| Fiscal Year | Smart Techlink, Petitions | JPMorgan Chase, Petitions |
|---|---|---|
| FY2023 | - | 4,359 (4070 cert.) |
| FY2024 | 7 (7 cert.) | 3,541 (2903 cert.) |
| FY2025 | 9 (9 cert.) | 3,534 (3517 cert.) |
| FY2026 | 2 (2 cert.) | 527 (526 cert.) |